Multichip fan out project for IoT taps European expertise

Multichip fan out project for IoT taps European expertise

A key project to develop multichip fan out wafer level packages for the next generation of 3D stacked chip in the Internet of Things (IoT) has tapped expertise from several European companies. The A*STAR Institute of Microelectronics (IME) in Singapore has set up a development line to accelerate the development of fan-out wafer level packaging (FOWLP) capabilities for next-generation Internet of Things (IoT) technologies. The FOWLP development line is built upon existing infrastructure at IME’s facilities at Singapore Science Park II and new facilities at Fusionopolis Two. This will allow IME and partners such as equipment maker SPTS (part […]

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